Karl Suss MA6 - Backside and Topside Alignment

Inrfucirvine
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6213

View the SOP documentation http://www.inrf.uci.edu/sop-ksma6/ The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6'' in diameter. It uses 5" masks System and it can be operated manually. All contact exposure programs (vacuum, hard, soft contact and proximity) are provided to print structures far into the submicron region. Visit the Karl Suss MA6 Mask Aligner page http://www.inrf.uci.edu/facility/equipment/lithography/karl-suss-ma6-mask-aligner/

Published by: Inrfucirvine Published at: 10 years ago Category: علمی و تکنولوژی
SUSS MicroTec (Organization) Karl Suss MA6 uci university of california irvine inrf integrated nanosystems research facility Nanotechnology (Technology Class) cleanroom bion Standard Operating Procedure (Film) Photolithography (Invention) dideo دیدئو karl suss ma6 دیدئو dideo mask aligner contact backside topside alignment view sop documentation httpwwwinrfuciedusopksma6the performs high resolution photolithography offers