XeF2 Pulsing Etcher - How to prepare the sample

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View the SOP documentation http://www.inrf.uci.edu/sop-xef2/ This tool uses XeF2 crystals and a vacuum chamber to produce fluorine vapors which isotropically etch silicon with very high selectivities to photoresist, oxides, nitrides and many metals. Typical silicon etch rates are 1-2um per minute. Samples up to 4 inch diameter can be accommodated and the etch process may be observed through the transparent chamber lid. XeF2 Pulsing Etcher - Standard Operating Procedures https://youtu.be/vlL-X3XG00s

Published by: Inrfucirvine Published at: 8 years ago Category: علمی و تکنولوژی
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