Advanced Rigid Flex Circuit Constructions

Epec Engineered Technologies
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Rigid-flex circuit technology and construction methods allow for a wide variety of advanced design options that can further expand the extent of design integration possible. Common rigid-flex circuit design typically consists of 4 to 8 layer rigid sections with 2 flex layers. Options including higher flex layer counts, blind /buried vias, ZIF connections, flex area components, attachment PSAs, asymmetrical constructions and multiple rigid area thicknesses provide many opportunities to achieve higher levels of packaging density. In this webinar we introduce and discuss the benefits and application of advanced rigid-flex circuit board constructions. For more information on our flex and rigid-flex PCB solutions visit http://www.epectec.com/flex/

Published by: Epec Engineered Technologies Published at: 6 years ago Category:
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